Wide Bandgap Power Semiconductor Packaging
  • Release Date : 13 June 2018
  • Publisher : Woodhead Publishing
  • Genre : Technology & Engineering
  • Pages : 240 pages
  • ISBN 13 : 0081020945
Ratings: 4
From 235 Voters
Get This Book

Download or read book entitled Wide Bandgap Power Semiconductor Packaging by author: Katsuaki Suganuma which was release on 13 June 2018 and published by Woodhead Publishing with total page 240 pages . This book available in PDF, EPUB and Kindle Format. Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates

Nanoelectronics

Nanoelectronics

Author : Robert Puers,Livio Baldi,Marcel Van de Voorde,Sebastiaan E. van Nooten
Publisher : John Wiley & Sons
Genre : Technology & Engineering
Get Book
Materials for High Temperature Semiconductor Devices

Materials for High Temperature Semiconductor Devices

Author : Committee on Materials for High-Temperature Semiconductor Devices,Commission on Engineering and Technical Systems,National Materials Advisory Board,Division on Engineering and Physical Sciences,National Research Council
Publisher : National Academies Press
Genre : Technology & Engineering
Get Book
Materials for High Temperature Semiconductor Devices

Materials for High Temperature Semiconductor Devices

Author : National Research Council,Division on Engineering and Physical Sciences,National Materials Advisory Board,Commission on Engineering and Technical Systems,Committee on Materials for High-Temperature Semiconductor Devices
Publisher : National Academies Press
Genre : Technology & Engineering
Get Book