Wide Bandgap Power Semiconductor Packaging

Written By Katsuaki Suganuma
Wide Bandgap Power Semiconductor Packaging
  • Publsiher : Woodhead Publishing
  • Release : 28 May 2018
  • ISBN : 0081020953
  • Pages : 240 pages
  • Rating : /5 from reviews
GET THIS BOOKWide Bandgap Power Semiconductor Packaging


Download or read book entitled Wide Bandgap Power Semiconductor Packaging by author: Katsuaki Suganuma which was release on 28 May 2018 and published by Woodhead Publishing with total page 240 pages . This book available in PDF, EPUB and Kindle Format. Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates

Wide Bandgap Power Semiconductor Packaging

Wide Bandgap Power Semiconductor Packaging
  • Author : Katsuaki Suganuma
  • Publisher : Woodhead Publishing
  • Release Date : 2018-05-28
  • Total pages : 240
  • ISBN : 0081020953
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Summary : Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present ...

High Voltage Packaging Technology for Wide Bandgap Power Semiconductor Devices

High Voltage Packaging Technology for Wide Bandgap Power Semiconductor Devices
  • Author : Suhail Jeremy Rashid
  • Publisher : Unknown
  • Release Date : 2008
  • Total pages : 212
  • ISBN : 0081020953
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Summary : Read online High Voltage Packaging Technology for Wide Bandgap Power Semiconductor Devices written by Suhail Jeremy Rashid, published by which was released on 2008. Download full High Voltage Packaging Technology for Wide Bandgap Power Semiconductor Devices Books now! Available in PDF, ePub and Kindle....

Electronic Enclosures Housings and Packages

Electronic Enclosures  Housings and Packages
  • Author : Frank Suli
  • Publisher : Woodhead Publishing
  • Release Date : 2018-11-15
  • Total pages : 562
  • ISBN : 0081020953
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Summary : Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. ...

Wide Bandgap Semiconductor Power Devices

Wide Bandgap Semiconductor Power Devices
  • Author : B. Jayant Baliga
  • Publisher : Woodhead Publishing
  • Release Date : 2018-10-17
  • Total pages : 418
  • ISBN : 0081020953
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Summary : Wide Bandgap Semiconductor Power Devices: Materials, Physics, Design and Applications provides readers with a single resource on why these devices are superior to existing silicon devices. The book lays the groundwork for an understanding of an array of applications and anticipated benefits in energy savings. Authored by the Founder of ...

Disruptive Wide Bandgap Semiconductors Related Technologies and Their Applications

Disruptive Wide Bandgap Semiconductors  Related Technologies  and Their Applications
  • Author : Yogesh Kumar Sharma
  • Publisher : BoD – Books on Demand
  • Release Date : 2018-09-12
  • Total pages : 152
  • ISBN : 0081020953
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Summary : SiC and GaN devices have been around for some time. The first dedicated international conference on SiC and related devices, "ICSCRM," was held in Washington, DC, in 1987. But only recently, the commercialization of SiC and GaN devices has happened. Due to its material properties, Si as a semiconductor has limitations ...

Thermal and Electro Thermal System Simulation

Thermal and Electro Thermal System Simulation
  • Author : Márta Rencz,Lorenzo Codecasa
  • Publisher : MDPI
  • Release Date : 2019-11-18
  • Total pages : 222
  • ISBN : 0081020953
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Summary : With increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in changing electrical system parameters, changing the operation of devices, and sometimes even the destruction of devices. To prevent this, the thermal behavior has to be considered in ...

Compound Semiconductor

Compound Semiconductor
  • Author : Anonim
  • Publisher : Unknown
  • Release Date : 2003
  • Total pages : 212
  • ISBN : 0081020953
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Summary : Read online Compound Semiconductor written by , published by which was released on 2003. Download full Compound Semiconductor Books now! Available in PDF, ePub and Kindle....

State of the Art Program on Compound Semiconductors 49 SOTAPOCS 49 and Nitrides and Wide Bandgap Semiconductors for Sensors Photonics and Electronics 9

State of the Art Program on Compound Semiconductors 49  SOTAPOCS 49   and  Nitrides and Wide Bandgap Semiconductors for Sensors  Photonics  and Electronics 9
  • Author : J. Wang
  • Publisher : The Electrochemical Society
  • Release Date : 2008-10
  • Total pages : 228
  • ISBN : 0081020953
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Summary : This issue of ECS Transactions focuses on issues pertinent to materials growth, characterization, processing, development, application of compound semiconductor materials and devices, including nitrides and wide-bandgap semiconductors....

Electronic and Photonic Packaging Integration and Packaging of Micro nano electronic Systems 2005

Electronic and Photonic Packaging  Integration and Packaging of Micro nano electronic Systems  2005
  • Author : Anonim
  • Publisher : Amer Society of Mechanical
  • Release Date : 2005
  • Total pages : 606
  • ISBN : 0081020953
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Summary : Read online Electronic and Photonic Packaging Integration and Packaging of Micro nano electronic Systems 2005 written by , published by Amer Society of Mechanical which was released on 2005. Download full Electronic and Photonic Packaging Integration and Packaging of Micro nano electronic Systems 2005 Books now! Available in PDF, ePub and Kindle....

Proceedings 2003

Proceedings 2003
  • Author : Semiconductor Thermal Measurement and Management Symposium
  • Publisher : Unknown
  • Release Date : 2003
  • Total pages : 212
  • ISBN : 0081020953
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Summary : Read online Proceedings 2003 written by Semiconductor Thermal Measurement and Management Symposium, published by which was released on 2003. Download full Proceedings 2003 Books now! Available in PDF, ePub and Kindle....

Wide bandgap Semiconductors for High Power High Frequency and High Temperature Applications

Wide bandgap Semiconductors for High Power  High Frequency and High Temperature Applications
  • Author : Anonim
  • Publisher : Unknown
  • Release Date : 1999
  • Total pages : 212
  • ISBN : 0081020953
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Summary : Read online Wide bandgap Semiconductors for High Power High Frequency and High Temperature Applications written by , published by which was released on 1999. Download full Wide bandgap Semiconductors for High Power High Frequency and High Temperature Applications Books now! Available in PDF, ePub and Kindle....

Electronic Design

Electronic Design
  • Author : Anonim
  • Publisher : Unknown
  • Release Date : 1994
  • Total pages : 212
  • ISBN : 0081020953
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Summary : Read online Electronic Design written by , published by which was released on 1994. Download full Electronic Design Books now! Available in PDF, ePub and Kindle....

Proceedings 2001

Proceedings 2001
  • Author : Bruce Romenesko,International Microelectronics and Packaging Society,Society of Photo-optical Instrumentation Engineers
  • Publisher : Unknown
  • Release Date : 2001
  • Total pages : 782
  • ISBN : 0081020953
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Summary : Read online Proceedings 2001 written by Bruce Romenesko,International Microelectronics and Packaging Society,Society of Photo-optical Instrumentation Engineers, published by which was released on 2001. Download full Proceedings 2001 Books now! Available in PDF, ePub and Kindle....

Proceedings of the International Symposium on Microelectronics

Proceedings of the     International Symposium on Microelectronics
  • Author : Anonim
  • Publisher : Unknown
  • Release Date : 2002
  • Total pages : 212
  • ISBN : 0081020953
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Summary : Read online Proceedings of the International Symposium on Microelectronics written by , published by which was released on 2002. Download full Proceedings of the International Symposium on Microelectronics Books now! Available in PDF, ePub and Kindle....

Electronic Packaging Materials Science X Volume 515

Electronic Packaging Materials Science X  Volume 515
  • Author : Daniel J. Belton,M. Gaynes,E. G. Jacobs,R. Pearson,Tien Wu
  • Publisher : Mrs Proceedings
  • Release Date : 1998-10
  • Total pages : 262
  • ISBN : 0081020953
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Summary : Proceedings of the April 1998 symposium, which focused on high-density package solutions, with an emphasis on flip-chip technology. Topics include interfacial adhesion behavior, flip-chip interconnections, high-density substrates, thermomechanical behavior, and packaging reliability issues. Articles address the fracture of polymer interfaces and the delamination tendencies seen with flip-chip interconnections on organic substrates, ...