Three Dimensional Molded Interconnect Devices 3D MID

Written By Jörg Franke
Three Dimensional Molded Interconnect Devices  3D MID
  • Publsiher : Carl Hanser Verlag GmbH Co KG
  • Release : 03 April 2014
  • ISBN : 1569905525
  • Pages : 368 pages
  • Rating : /5 from reviews
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Download or read book entitled Three Dimensional Molded Interconnect Devices 3D MID by author: Jörg Franke which was release on 03 April 2014 and published by Carl Hanser Verlag GmbH Co KG with total page 368 pages . This book available in PDF, EPUB and Kindle Format. Three-dimensional molded interconnect devices (MIDs) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated into injection-molded components. Function integration on this scale goes hand in hand with a high level of geometrical design freedom and opportunities for miniaturization, plus the associated reduction in weight and savings on product costs. MIDs are made primarily of recyclable thermoplastics, so they are more environmentally compatible than alternatives produced using other available technologies. MIDs are used in virtually every sector of electronics. The many standard applications for MIDs in the automotive industry in particular also drive for further development and research into MID technology. The significance of MID technology is also increasing in medical engineering, IT and telecommunications and in industrial automation, with numerous applications now successfully implemented in all these various fields. This book offers a comprehensive insight into the state of the art in 3D-MID technology along the entire process chain. Individual chapters, moreover, deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.

Three Dimensional Molded Interconnect Devices 3D MID

Three Dimensional Molded Interconnect Devices  3D MID
  • Author : Jörg Franke
  • Publisher : Carl Hanser Verlag GmbH Co KG
  • Release Date : 2014-04-03
  • Total pages : 368
  • ISBN : 1569905525
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Summary : Three-dimensional molded interconnect devices (MIDs) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated into injection-molded components. Function integration on this scale goes hand in hand with a high level of geometrical design freedom and opportunities for miniaturization, plus the associated reduction in weight and savings on product ...

Three dimensional Molded Interconnect Devices 3D MID

Three dimensional Molded Interconnect Devices  3D MID
  • Author : Jörg Franke (Dipl.-Ing.)
  • Publisher : Unknown
  • Release Date : 2014
  • Total pages : 356
  • ISBN : 1569905525
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Summary : Read online Three dimensional Molded Interconnect Devices 3D MID written by Jörg Franke (Dipl.-Ing.), published by which was released on 2014. Download full Three dimensional Molded Interconnect Devices 3D MID Books now! Available in PDF, ePub and Kindle....

Application of In mold Decoration of Injection Molding in Three Dimensional Molded Interconnect Devices

Application of In mold Decoration of Injection Molding in Three Dimensional Molded Interconnect Devices
  • Author : Anonim
  • Publisher : Unknown
  • Release Date : 2014
  • Total pages : 181
  • ISBN : 1569905525
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Summary : Read online Application of In mold Decoration of Injection Molding in Three Dimensional Molded Interconnect Devices written by , published by which was released on 2014. Download full Application of In mold Decoration of Injection Molding in Three Dimensional Molded Interconnect Devices Books now! Available in PDF, ePub and Kindle....

Proceedings of the 6th CIRP Sponsored International Conference on Digital Enterprise Technology

Proceedings of the 6th CIRP Sponsored International Conference on Digital Enterprise Technology
  • Author : George Q. Huang,K.L. Mak,Paul G. Maropoulos
  • Publisher : Springer Science & Business Media
  • Release Date : 2009-12-12
  • Total pages : 1803
  • ISBN : 1569905525
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Summary : This Proceedings volume contains articles presented at the CIRP-Sponsored Inter- tional Conference on Digital Enterprise Technology (DET2009) that takes place December 14–16, 2009 in Hong Kong. This is the 6th DET conference in the series and the first to be held in Asia. Professor Paul Maropoulos initiated, hosted and chaired the 1st ...

Polymers in Electronics 2007

Polymers in Electronics 2007
  • Author : Anonim
  • Publisher : iSmithers Rapra Publishing
  • Release Date : 2007
  • Total pages : 208
  • ISBN : 1569905525
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Summary : This conference saw presentations from all parts of the electronics industry's materials supply chain, from raw materials to finished products and offered an opportunity to learn more about both traditional and new polymer materials, their markets, manufacturing processes and applications. It also covered the impact of legislation, the need to ...

Micro Manufacturing Technologies and Their Applications

Micro Manufacturing Technologies and Their Applications
  • Author : Irene Fassi,David Shipley
  • Publisher : Springer
  • Release Date : 2017-01-31
  • Total pages : 296
  • ISBN : 1569905525
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Summary : This book provides in-depth theoretical and practical information on recent advances in micro-manufacturing technologies and processes, covering such topics as micro-injection moulding, micro-cutting, micro-EDM, micro-assembly, micro-additive manufacturing, moulded interconnected devices, and microscale metrology. It is designed to provide complementary material for the related e-learning platform on micro-manufacturing developed within the ...

Microengineering of Metals and Ceramics Part I

Microengineering of Metals and Ceramics  Part I
  • Author : Henry Baltes,Oliver Brand,Gary K. Fedder,Christofer Hierold,Jan G. Korvink,Osamu Tabata,Detlef Löhe,Jürgen Hausselt
  • Publisher : John Wiley & Sons
  • Release Date : 2008-09-26
  • Total pages : 392
  • ISBN : 1569905525
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Summary : Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from ...

Microengineering of Metals and Ceramics

Microengineering of Metals and Ceramics
  • Author : Henry Baltes,Oliver Brand,Gary K. Fedder,Christofer Hierold,Jan G. Korvink,Osamu Tabata,Detlef Löhe,Jürgen Hausselt
  • Publisher : John Wiley & Sons
  • Release Date : 2008-09-26
  • Total pages : 306
  • ISBN : 1569905525
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Summary : Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from ...

Digital Enterprise Technology

Digital Enterprise Technology
  • Author : Pedro Filipe Cunha,Paul G. Maropoulos
  • Publisher : Springer Science & Business Media
  • Release Date : 2007-09-18
  • Total pages : 593
  • ISBN : 1569905525
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Summary : The first Digital Enterprise Technology (DET) International Conference was held in Durham, UK in 2002 and the second DET Conference in Seattle, USA in 2004. Sponsored by CIRP (College International pour la Recherche en Productique), the third DET Conference took place in Setúbal, Portugal in 2006. Digital Enterprise Technology: Perspectives and Future ...

Reflow Soldering

Reflow Soldering
  • Author : Balázs Illés,Oliver Krammer,Attila Geczy
  • Publisher : Elsevier
  • Release Date : 2020-07-02
  • Total pages : 294
  • ISBN : 1569905525
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Summary : Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special ...

Polymers in Organic Electronics

Polymers in Organic Electronics
  • Author : Sulaiman Khalifeh
  • Publisher : Elsevier
  • Release Date : 2020-04-01
  • Total pages : 616
  • ISBN : 1569905525
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Summary : Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental ...

4M 2006 Second International Conference on Multi Material Micro Manufacture

4M 2006   Second International Conference on Multi Material Micro Manufacture
  • Author : Stefan Dimov,Wolfgang Menz,Bertrand Fillon
  • Publisher : Elsevier
  • Release Date : 2006-09-15
  • Total pages : 448
  • ISBN : 1569905525
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Summary : 4M 2006 - Second International Conference on Multi-Material Micro Manufacture covers the latest state-of-the-art research results from leading European researchers in advanced micro technologies for batch processing of metals, polymers, and ceramics, and the development of new production platforms for micro systems-based products. These contributions are from leading authors at a ...

Theory and Phenomena of Metamaterials

Theory and Phenomena of Metamaterials
  • Author : Filippo Capolino
  • Publisher : CRC Press
  • Release Date : 2017-12-19
  • Total pages : 974
  • ISBN : 1569905525
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Summary : Theory and Phenomena of Metamaterials offers an in-depth look at the theoretical background and basic properties of electromagnetic artificial materials, often called metamaterials. A volume in the Metamaterials Handbook, this book provides a comprehensive guide to working with metamaterials using topics presented in a concise review format along with numerous ...

Smart Technologies for Precision Assembly

Smart Technologies for Precision Assembly
  • Author : Svetan Ratchev
  • Publisher : Springer Nature
  • Release Date : 2021
  • Total pages : 370
  • ISBN : 1569905525
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Summary : This open access book constitutes the refereed post-conference proceedings of the 9th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2020, held virtually in December 2020. The 16 revised full papers and 10 revised short papers presented together with 1 keynote paper were carefully reviewed and selected from numerous submissions. The papers address topics such as ...

Cyber Physical and Gentelligent Systems in Manufacturing and Life Cycle

Cyber Physical and Gentelligent Systems in Manufacturing and Life Cycle
  • Author : Berend Denkena,Tobias Morke
  • Publisher : Academic Press
  • Release Date : 2017-06-07
  • Total pages : 492
  • ISBN : 1569905525
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Summary : Cyber-Physical and Gentelligent Systems in Manufacturing and Life Cycle explores the latest technologies resulting from the integration of sensing components throughout the production supply chain, and the resulting possibilities to improve efficiency, flexibility, and product quality. The authors present cutting edge research into data storage in components, communication devices, data ...